| January 28, 2009 | |||||
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DNP Develops the World’s Slimmest Printed Wiring Board Embedded with Components Potential in Further Miniaturization and High Performance of Digital Equipment |
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Dai Nippon Printing Co., Ltd. (DNP) has developed the world’s slimmest printed wiring board (PWB) embedded with IC chips and passive components, such as condensers and resisters.
The newly developed PWB employs B2it *, a manufacturing technology unique to DNP. By making improvements to the board and wiring materials, DNP has succeeded in reducing the thickness of the PWB to 0.45mm from 0.65mm in existing DNP products. Sample shipments will begin from February. |
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[Developmental Background]
Digital equipment, including mobile phones, notebook PCs, digital cameras and car navigation systems are moving in the direction of higher performance, as well as facing increased needs for slimmer and more compact devices, which in turn is fueling demands for improvements in the parts used in this equipment. To meet these demands, DNP led the industry in April 2006 when it employed its unique B2it technology and commenced mass production of PWBs embedded with passive components. The company furthered this success in January 2008 by producing PWBs embedded with IC chips and passive components. This new product has been well received, as it fulfills the need for IC chips and passive components that customers desire to be embedded inside the board, and November 2008 saw total production top the 100 million unit level. |
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[Overview of New PWB]
With B2it technology, miniaturization and higher density are facilitated as three-dimensional structures are formed with IC chips, such as LSI, and passive components embedded inside the board, and mounted on the surface of the board. As it is also possible to freely arrange electrical contacts between the layers, IC chips and passive components inside the board and components on the surface can be connected over the shortest possible distances, which, in addition to stabilizing performance of the IC chips, also improves reliability as a module. By altering board and wiring materials, and being creative with the positioning and wiring of the embedded components, DNP has successfully slimmed down the product profile by 30 percent compared to existing products, to 0.45mm. |
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[Forward Looking Developments]
DNP will commence production of the newly developed slim PWB embedded with components from February, and aims for approximately ¥3.0 Bln in sales in the year ending March 31, 2011. The company will also exhibit this newly developed PWB at the DNP booth (West 6-14) at the NEPCON WORLD JAPAN (the 10th PRINTED WIRING BOARDS EXPO) to be held at Tokyo Big Sight from January 28. |
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(*1)B2it technology
"B2itTM" is DNP's unique technology for a buildup PWB, which connects adjacent conductive layers by bumps made of high conductivity paste and formed by screen printing. Because there is no plated through-hole for electrically connecting between the conductive layers, which leaves a broader area to mount components on the PWB. As electrical contacts can be freely arranged throughout all the layers, this technology also has a characteristic of allowing for broad latitude in wiring design. | |||||
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* Product price, specification and service content listed in this news release are as of time of going to press. This data may change without notice. We apologize for any inconvenience.
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