Dai Nippon Printing Co., Ltd. (DNP) and Unimicron Technology Corporation (Unimicron) have established a high-density printed wiring board (PWB) manufacturing line, using DNP’s unique build-up board manufacturing technology(*1), at the Unimicron plant in Kunshan, China. Sample shipments were commenced from May, and mass production will be launched from July.

[Background]
In line with the emergence of high function digital equipment, including mobile phones, notebook PCs and digital cameras, there has also been an increasing demand for a shift to high density, such as scaling down and lower profiling of PWBs used in this equipment. Mobile digital equipment with particularly strong demands for scaling down and lower profiling is often manufactured in Asia including China. PWB manufacturers face the need to locate their factories and plants close to those of their clients, mobile digital terminal manufacturers, in order to be able to respond in a timely manner to demand. DNP and Unimicron, which manufactures PWBs, have established a PWB manufacturing and marketing joint venture, and have pushed ahead with preparations for the establishment of a new manufacturing line to produce high density PWBs, using build-up board manufacturing technology.
We are pleased to announce that a new line has been completed at the Unimicron plant in Kunshan, China, and shipment has begun of PWBs for use in digital home appliances and telecommunications devices.

[Product Summary]
The Product employs DNP’s unique manufacturing technology of buildup PWBs enabling high density such as scaling down and lower profiling. Compared to other buildup PWB manufacturing techniques, this technology maintains the following superior features;

• It is possible to freely configure electrical connections between conductive layers of a PWB.
• As no plating process is used in making electrical connections between conductive layers, there is no need for waste liquid processing or waste liquid disposal facilities, and least adverse impact on environment.
• It offers an extremely high level of board design latitude, including allowing for mounting components on electrical connections of the surface.
• It is suitable for the manufacture of PWBs embedded with components such as IC chips and/or condensers.

[Looking Ahead]
DNP aims to add manufacturing lines at the Unimicron plant in Kunshan, China to stay abreast of demand, and will increase manufacturing capability to approximately 10,000 square meters per month.
DNP will enhance the PWB manufacturing system using build-up board manufacturing technology, and in addition to further business expansion, will proceed with licensing contracts for the technology with PWB manufacturers on a global basis, aiming to establish a global standard. The manufacturing lines at DNP’s Kuki plant mainly produce high precision PWBs which contain strong developmental elements, while the manufacturing line at the Unimicron plant in Kunshan, China, is geared to the high production of mass produced products, and as such the two manufacturing bases are expected to stand in a complementary relationship going forward. Sales of approximately 18.0 billion yen are targeted from the manufacturing line at the Unimicron plant in Kunshan, China in the year ending March 31, 2013.

Dai Nippon Printing Co. Ltd.
Head Quarters: Tokyo / CEO: Yoshitoshi Kitajima

Unimicron Technology Corporation
Head Quarters: Tao Yuan, Taiwan / CEO: T.J Tseng