DNP ELECTORONIC DEVICE Japanese Home Page
Products and Technology Sitemap
・[2010/08/06] It is in our summer holidays from Aug.7 to Aug.15. 【details
・[2010/07/07] DNP will show MEMS foundary solutions at DNP booth (D26, East Hall 5) in Exhibition Micromachine/MEMS (July 28 -30, Tokyo Big Sight) 【details
・[2010/06/05] Thank you for visiting the DNP booth in 2010 JPCA show. We very much appreciate your attention. 【details
  Archives
DNP HOMEPAGE Copyright (C) DAI NIPPON PRINTING CO., LTD.
Photomasks
> TOP
> Photomasks for semiconductor chips
> Large size photomasks
IC leadframes
> TOP
> Etching leadframe
> LOC lead frame
> Multiple layer leadframe
> New-LF
> QFN
> Bump chip carrier
> DNP IC leadframe Global Contact
B2it printed wiring boards
> TOP
> Design rule
> All B2it PWB
> Combination B2it PWB
> Embedded B2it PWB
> Earth conscious PWB
> B2it PWB for camera module
IC tags
> TOP
> IC tags
> Examples of applications
MEMS
> TOP
> Technology
> Example of device manufacturing
Si Interposer with TSV
> OUTLINE
> Technique
> Specifications
Metal processed products
> TOP
> Metal etching manufacturing technology
> Electroforming manufacturing technology
Test Chart & Color Viewer
> TOP
> Test Chart Forms (Reflection type·Transparent type)
> JEITA Test Chart (4:3 Type)
> ITE Test Chart(4:3type)
> ITE Test Chart (16:9 Type)
> ITE Test Chart (HD 16:9 Type)
> Other Test Charts
Custom Test Charts
> How to order
> Sample
Standard Color Viewer
> Standard
> For HDTV
New products and technologies
> TOP
> Organic substrate for semiconductor package
> Ultra-thin, fine pitch wired substrates for semiconductor packages
> Highly precised, multi-layered, organic build-up package substrates
> Wireless suspension blank
:::: Inquiry ::::
:::: Local contacts ::::
Electronic Device Operations
DNP LSI Design Co., Ltd.
D.T. Fine Electronics Co.,Ltd.
DNP America,LLC Electronic Device Operations
Global network
GSA Beam Initiative