| Etching process: Using the photofabrication
process, a thin metal plate is processed into a leadframe. |
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| Partial silver plating process: Silver
plating is carried out selectively on the wire bonding section. |
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| Taping process: To maintain inner leads
position, the inner lead is locked with polyimide tape. |
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| Downset process: The die pad section onto
which the die will be bonded is depressed by downset tool. |
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| Lead tip cut process: A technique to produce
the most advanced leadframes. It is to keep inner leads connected
during etching process, plating process and taping process to
prevent lead tips transformation problem from occuring. the
connected portions are then cut off in the final process. It
is quite effective for preventing the lead from changing its
shape during the plating process, and for accurately maintaining
the inner lead position achieved by the photo fabrication process.
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