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Technical Overview
DNP supports wide arrays of technology nodes, but excel in the production of the cutting edge. As the focal definition of cutting edge has shifted from 65nm production to 45nm and then to 32nm, DNP has propelled chip manufacturability along the way through supplying high quality photomasks that has industry acclaim.
Future discussion of 22nm technology and beyond is in the seed stage, but DNP milestones stay ahead of the pack in preparedness and flexibility. The combination of high-end tool installation plans coupled with capable technical staff will continue to minimize the learning curve associated with technology generation transition, and ultimately help the customer's bottom line.
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Photomasks
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> Photomasks for semiconductor chips
> Large size photomasks
IC leadframes
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> Etching leadframe
> LOC lead frame
> Multiple layer leadframe
> New-LF
> QFN
> Bump chip carrier
> DNP IC leadframe Global Contact
B2it printed wiring boards
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> Design rule
> All B2it PWB
> Combination B2it PWB
> Embedded B2it PWB
> Earth conscious PWB
> B2it PWB for camera module
IC tags
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> IC tags
> Examples of applications
MEMS
> TOP
> Technology
> Example of device manufacturing
Si Interposer with TSV
> OUTLINE
> Technique
> Specifications
Metal processed products
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> Metal etching manufacturing technology
> Electroforming manufacturing technology
Test Chart & Color Viewer
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> Test Chart Forms (Reflection type·Transparent type)
> JEITA Test Chart (4:3 Type)
> ITE Test Chart(4:3type)
> ITE Test Chart (16:9 Type)
> ITE Test Chart (HD 16:9 Type)
> Other Test Charts
Custom Test Charts
> How to order
> Sample
Standard Color Viewer
> Standard
> For HDTV
New products and technologies
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> Organic substrate for semiconductor package
> Ultra-thin, fine pitch wired substrates for semiconductor packages
> Highly precised, multi-layered, organic build-up package substrates
> Wireless suspension blank
:::: Inquiry ::::
:::: Local contacts ::::
Electronic Device Operations
DNP LSI Design Co., Ltd.
D.T. Fine Electronics Co.,Ltd.
DNP America,LLC Electronic Device Operations
Global network
GSA Beam Initiative