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[ Message from the Director ] [ History ] [ Plants and Offices ]


Junichi Tsuchiya
Corporate Officer
General Manager of
Electronic Device Operations

Welcome to our website.

After the successful development of shadow masks for color TVs in 1958, DNP’s Electronics Division has made progress based on “Expanding Printing Technology” as a fundamental DNP policy. Electronic Device Operations separated from the former Micro Product Operations in 1999, and newly started operations of photomasks and lead frames as major products. We at Electronic Device Operations have contributed to the electronic device industry by high-precision processing on the nanometer level taking advantage of application and derivation of printing technologies.

We produce IC tags, MEMS, passive component embedded wiring boards and so on in addition to photomasks which are patterns for large-scale integrated circuits, lead frames which form connections of integrated circuits, and suspensions for hard disks. Moreover, we tackle the development of nanoimprint, fuel cell components, architectures for image processing, and optical components etc.

In the harsh industry which requires fast-evolving technology innovations, we have gained high market shares by technical capabilities that engender the trust of the world. Continuing to invest in R&D proactively and form an alliance or a collaboration with other companies, we intend to expand the business field further.

At the same time, we view product safety as one of our top priorities, and we all work together to promote efforts to maintain product safety. By focusing on developing products and manufacturing processes that put the least possible strain on the environment, we contribute to realization of the earth-friendly society.

In order to make this current situation more fruitful, please let us know your opinions about our products or your requests for new products. It is our hope that we can engage in lively dialogue with all of you through our web site.



:::: History of the Electronic Device Operations

 Events related to development of new products, and volume production
 Events related to quality and environmental activities
 Events related to collaboration, merge, acquisition and organization change.

1958
Developed shadowmasks for color TVs
1959
Developed prototypes of photomasks for semiconductors
1960
Started production of shadowmasks (Currently Display Operations produces them.)
1961
Started production of photomasks (Emulsion masks)
1964
Started production of IC leadframes.
1967
Started production of photomasks (chrome masks)
1970
Made the Japan's first introduction of EB (electron beam) writing technologies and CAD as a commercial maskshop.
1979
Introduced EB writing tool "MEBES" to Kami-fukuoka plant
1982
Established Micro Product Laboratory (Now Electronic Device Laboratory)
1986
Established DNP LSI Design Co. Ltd.
1989
Won a PM Excellent Plant Award (PM award)
1993
Won a PM Excellent Plant Award (Special award)
1994
Kami-fukuoka plant obtained certification for compliance with ISO 9002.
1998
Kyoto plant obtained certification for compliance with ISO 9002.
Developed suspensions for hard disks formed by dry etching.
1999
The captive maskshop of Hitachi Ltd. was transferred to Electronic Device Operations.
2000
Developed IC tag "ACCUWAVE".
Developed suspensions for hard disks formed by wet etching.
Started a joint development of photomask manufacturing technology with Intel for the next generation microprocessors.
Established a joint maskshop "DT Fine Electronics Co.,Ltd" with Toshiba Corporation.
Announced a collaboration of photomask business with Fujitsu Limited.
Established a joint company "DT Circuit technology (Now DTCT division )" with Toshiba Corporation as succession of Toshiba's printed wiring board business including B2it technology.
2002
Developed rigid-flexible printed wiring boards "i-B2it"
Kami-fukuoka plant obtained certification for compliance with ISO 9001.
Kyoto plant obtained certification for compliance with ISO 14000.
Developed MPEG-4 module
Established a joint maskshop "DNP Photomask Europe S.p.A" with STMicroelectronics
Started a joint development of next generation mask blanks with HOYA Corporation.
2003
Kyoto plant obtained certification for compliance with ISO 9001.
2004
Kami-fukuoka plant obtained certification for compliance with ISO 14000.
Won the Second Monodzukuri Component Prize for MPEG-4 TV telephone boards.
2006
Started the Japan's first volume production of passive component embedded wiring boards.
Won the 4th Monozukuri Component Prize for passive component embedded wiring boards.
2007
Received transfer of photomask manufacturing and marketing interests from NEC Electronics Corporation and NEC Fabserve Ltd., and started operations under a newly formed company - DNP Fine Electronics Sagamihara Co., Ltd.


:::: Plants and Offices of Electronic Device Operations

Plants and Offices of Electronic Device Operations
Photomask Global ContactIC Leadframe Global Contact
DNP HOMEPAGE Copyright (C) DAI NIPPON PRINTING CO., LTD.
Photomasks
> TOP
> Photomasks for semiconductor chips
> Large size photomasks
IC leadframes
> TOP
> Etching leadframe
> LOC lead frame
> Multiple layer leadframe
> New-LF
> QFN
> Bump chip carrier
> DNP IC leadframe Global Contact
B2it printed wiring boards
> TOP
> Design rule
> All B2it PWB
> Combination B2it PWB
> Embedded B2it PWB
> Earth conscious PWB
> B2it PWB for camera module
IC tags
> TOP
> IC tags
> Examples of applications
MEMS
> TOP
> Technology
> Example of device manufacturing
Si Interposer with TSV
> OUTLINE
> Technique
> Specifications
Metal processed products
> TOP
> Metal etching manufacturing technology
> Electroforming manufacturing technology
Test Chart & Color Viewer
> TOP
> Test Chart Forms (Reflection type·Transparent type)
> JEITA Test Chart (4:3 Type)
> ITE Test Chart(4:3type)
> ITE Test Chart (16:9 Type)
> ITE Test Chart (HD 16:9 Type)
> Other Test Charts
Custom Test Charts
> How to order
> Sample
Standard Color Viewer
> Standard
> For HDTV
New products and technologies
> TOP
> Organic substrate for semiconductor package
> Ultra-thin, fine pitch wired substrates for semiconductor packages
> Highly precised, multi-layered, organic build-up package substrates
> Wireless suspension blank
:::: Inquiry ::::
:::: Local contacts ::::
Electronic Device Operations
DNP LSI Design Co., Ltd.
D.T. Fine Electronics Co.,Ltd.
DNP America,LLC Electronic Device Operations
Global network
GSA Beam Initiative
DNP America LLC(Santa Clara) DNP America LLC(Santa Clara) DNP America LLC(Dallas) DNP Photomask Europe S.p.A.(Agrate, Italy) DNP Photomask Europe S.p.A.(Agrate, Italy) DNP Photomask Technology Taiwan Co.,Ltd. (Hsinchu) Projected startup in 2008 DNP Photomask Technology Taiwan Co.,Ltd. (Hsinchu) Projected startup in 2008 DNP Korea Co.,Ltd. (Soul) Hsinchu(Taiwan) Shanghai Singapore tokyo sales office