Dai Nippon Printing has developed through-silicon via technology using silicon deep reactive ion etching(DRIE),electroplating and film deposition.
Through Silicon via technology makes it possible to meet the requirements for 3D stacking IC, Silicon interposer and MEMS packaging.
DNP’s Si interposer with TSVs have many advantages.
Features of DNP’s Si interposer are ;
・high density via for Si interposer
・high density build-up layers by semi-additive method on through-silicon via
・a flexibly designed rule by stacked vias
・a high frequency characteristic with high resistivity of silicon wafer
・a high electrical characteristic by a low relative dielectric constant
・available for embedded passive components; L, C, R
・applicable for comprehensive applications; interposer, 3D-interconecct, sensor, etc |
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| Si interposer with Through-Silicon Via |
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