DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging

Participates in JOINT2, consortium targeting mass-production in 2024

Dai Nippon Printing Co., Ltd. (DNP) has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates. The interposer is expected to play a key role in next-generation semiconductor packaging.



DNP also has participated in Jisso Open Innovation of Tops 2 (JOINT2), targeting further functional developments for mass-production in 2024. JOINT2 is a consortium comprising 12 companies developing semiconductor packaging materials, substrates, and equipment. Showa Denko Materials Co., Ltd. is the managing company, and was selected for the Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems by the New Energy and Industrial Technology Development Organization (NEDO).

“Through cooperation on development with the other participating JOINT2companies, DNP will accelerate the further functionality of the interposer as well as advance initiatives aimed at mass production in 2024. We will also promote the development of next-generation semiconductor packaging technology.” says Ryoichi Ohigashi of the Research and Business Development Center, DNP.


Background

The shift to higher functionality, greater speed and lower power consumption for semiconductor products requires miniaturization technology of semiconductor by using photo-lithography. It has been pointed out, however, that further miniaturization is rapidly approaching its natural limit, due to the complexity of the process and high costs. In an attempt to overcome these challenges, the focus is on next-generation semiconductor packaging technology that improves processing speed by mounting multiple chips (e.g., CPUs, AI processors and memories) at high-densities, on the surface of an interposer.

Interposer Features


Interposer produced on a glass substrate (40x40mm)

The interposer developed by DNP overcomes the issue of an increase in wiring resistance, and degradation of insulation resistance between the wirings, to achieve the high-performance necessary for leading edge semiconductor packaging.

DNP manufactures templates for nanoimprint lithography, a next-generation pattern transfer technology by taking advantage of microfabrication technology based on printing processes. We also broadly expand businesses through micro-electro mechanical systems (MEMS) foundry services for sensors. In this latest development, we have applied glass and silicon substrate processing developed through the aforementioned businesses for advanced packaging technologies, along with handling technology and fine wiring formation technology.

About DNP

Since 1876, DNP is a global leader in the provision of printing solutions that connect people and society, providing new value. We exploit our proprietary strengths in printing and information to propose solutions that support the development of a people-friendly information society, including electronic components targeting next-generation communications, and platforms that boost IoT information security.


*Company names, products and service names appearing in this release are the trademarks or registered trademarks of those companies.
*Product information and service details described in this release are accurate as of the date of issue. They are subject to change without notice.